ASEM TECHNOLOGY SDN BHD

Malaysia · Semiconductor Manufacturing

BUSINESS HIGHLIGHTS Our business mainly revolved around: MACHINE BIDDING MACHINE REFURBISHMENT MACHINE SCRAPPING We have more than 30 years experience in the industry. Other than the main business activities, we offer equipment & packaging solution for semiconductor, Chip on Board & SMT assembly industry. Additionally, we also provide equipment sales, spare parts, upgrade service & technical support. Key equipment resales includes Alphasem, ASM, Disco, K&S, Kaijo, Shinkawa, TSK Solution etc. OUR EXPERIENCE Our core strength is on the continuous improvement of equipment and process capability. The team experience covers from Microwave, IC, MLP, PGA, LED, Discrete (Micro & Power) and Clip Bonding (SMA, SMB, SMC) Assembly. Moreover, we have successfully assisted several multinational company in developing new package assembly development e.g. Processor, Power Mite, SMT Fuse & PGA. Our first product developed, Gas Monitoring System & Nozzle Gas Kit for semiconductor copper wire bonding application has been well qualified and used in the industry. The product is aim to enhance copper bonding process and it has been successfully implemented at the customer site.