Cadence is a market leader in AI and digital twins, pioneering the application of computational software to accelerate innovation in the engineering design of silicon to systems. Our design solutions, based on Cadence’s Intelligent System Design™ strategy, are essential for the world’s leading semiconductor and systems companies to build their next-generation products from chips to full electromechanical systems that serve a wide range of markets, including hyperscale computing, mobile communications, automotive, aerospace, industrial, life sciences and robotics. In 2024, Cadence was recognized by the Wall Street Journal as one of the world’s top 100 best-managed companies. Cadence solutions offer limitless opportunities—learn more at www.cadence.com.
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열5| 회사 | 시장 | 신규 시장 | 모멘텀 | 활동 | 확장 점수 |
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Facilities Manager
공고 보기Yokohama, Kanagawa, Japan · 5일 전
Application Engineer - Physical Design (Back-End)
공고 보기Petah Tikva, Center District, Israel · 5일 전
Application Engineer - Physical Design (Back-End)
공고 보기Haifa, Haifa District, Israel · 5일 전
At #COMPUTEX2026, Cadence unveils the industry’s first fully autonomous virtual engineer for chip design. With the Level-5 ChipStack AI Super Agent, we’re moving beyond AI assistance to true autonomy—enabling systems that plan, implement, and optimize complex design and verification workflows. Powered by Cadence’s physics-based engines and built with NVIDIA Nemotron and NVIDIA OpenShell secure runtime, this breakthrough delivers: ✅ Up to 40X faster RTL validation ✅ From weeks to less than a day ...
종료됨The chip design process is at the heart of today’s digital economy—and it’s only getting bigger, with projections reaching $16.5T by 2028. 🚀This white paper explores the transformative power of the ChipStack AI Super Agent, highlighting how it’s redefining the way chips are designed. By accelerating development cycles, optimizing workflows, and significantly reducing costs, ChipStack is enabling teams to innovate faster and more efficiently than ever before.From AI-driven automation to smarter ...
종료됨
Join us for the 𝐌𝐒𝐂 𝐒𝐨𝐟𝐭𝐰𝐚𝐫𝐞 & 𝐁𝐄𝐓𝐀 𝐂𝐀𝐄 User Conference 2026 on June 10-11 and explore the future of AI-driven simulation, CAE innovation, and digital engineering.Register Now: https://lnkd.in/eBd-bFHB ...
진행 중Cadence의 새로운 동적 전력 분석 앱으로 엔지니어들이 수 시간 내에 10억 게이트 AI 칩 설계를 분석하고 97% 정확도로 전력 추정이 가능해졌습니다.
Alcor Micro가 OCP 서밋에서 AI 및 HPC용 Mobius100 CPU 공개. Arm CSS V3 아키텍처와 PQC 보안 기능 탑재.
Cadence가 칩 설계 및 검증을 혁신할 AI '슈퍼 에이전트'를 공개하며, 프론트엔드 실리콘 프로세스의 생산성을 10배 향상시킬 것을 약속합니다.
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