CIT Co. Ltd.

दक्षिण कोरिया · अर्धचालक

🏆 CES Innovation Award 2025 Honoree! (Vehicle Tech & Advanced Mobility) For high-speed communication and next-generation semiconductor technologies, materials with ultra-low dielectric constant and high reliability are essential. CIT develops ultra-low dielectric FCCL and glass substrates for semiconductor packages using its proprietary ASE (Atomic Sputtering Epitaxy) technology. This technology maintains nanometer-level surface roughness, providing optimal performance for high-speed data transmission. Our innovation has been recognized by leading journals such as Nature and Advanced Materials. Discover CIT's innovative technology now and enhance your communication and semiconductor performance.