Cadence is a market leader in AI and digital twins, pioneering the application of computational software to accelerate innovation in the engineering design of silicon to systems. Our design solutions, based on Cadence’s Intelligent System Design™ strategy, are essential for the world’s leading semiconductor and systems companies to build their next-generation products from chips to full electromechanical systems that serve a wide range of markets, including hyperscale computing, mobile communications, automotive, aerospace, industrial, life sciences and robotics. In 2024, Cadence was recognized by the Wall Street Journal as one of the world’s top 100 best-managed companies. Cadence solutions offer limitless opportunities—learn more at www.cadence.com.
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欄位5| 公司 | 市場 | 新市場 | 動能 | 活動 | 擴張評分 |
|---|---|---|---|---|---|
 Cadence你 | 0 | 0 | — | 0 | 0 |
Facilities Manager
查看招聘Yokohama, Kanagawa, Japan · 5日前
Application Engineer - Physical Design (Back-End)
查看招聘Petah Tikva, Center District, Israel · 5日前
Application Engineer - Physical Design (Back-End)
查看招聘Haifa, Haifa District, Israel · 5日前
At #COMPUTEX2026, Cadence unveils the industry’s first fully autonomous virtual engineer for chip design. With the Level-5 ChipStack AI Super Agent, we’re moving beyond AI assistance to true autonomy—enabling systems that plan, implement, and optimize complex design and verification workflows. Powered by Cadence’s physics-based engines and built with NVIDIA Nemotron and NVIDIA OpenShell secure runtime, this breakthrough delivers: ✅ Up to 40X faster RTL validation ✅ From weeks to less than a day ...
已結束The chip design process is at the heart of today’s digital economy—and it’s only getting bigger, with projections reaching $16.5T by 2028. 🚀This white paper explores the transformative power of the ChipStack AI Super Agent, highlighting how it’s redefining the way chips are designed. By accelerating development cycles, optimizing workflows, and significantly reducing costs, ChipStack is enabling teams to innovate faster and more efficiently than ever before.From AI-driven automation to smarter ...
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Join us for the 𝐌𝐒𝐂 𝐒𝐨𝐟𝐭𝐰𝐚𝐫𝐞 & 𝐁𝐄𝐓𝐀 𝐂𝐀𝐄 User Conference 2026 on June 10-11 and explore the future of AI-driven simulation, CAE innovation, and digital engineering.Register Now: https://lnkd.in/eBd-bFHB ...
進行中Cadence新的動態功耗分析應用程式使工程師能在數小時內分析十億門級AI晶片設計，實現97%的功耗估算準確性。
Alcor Micro 在 OCP 峰會展示 Mobius100 CPU，採用 Arm CSS V3 架構，針對 AI 和 HPC 優化，並具備 PQC 安全功能。
Cadence推出AI'超級代理'，革新晶片設計和驗證，承諾將前端矽工藝生產力提高10倍。
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