Yangtze Memory Technologies Co., Ltd. (“YMTC”), established in Wuhan, China in July 2016, is an IDM memory company focusing on the design, production, and sales of 3D NAND flash memory. YMTC provides 3D NAND wafer, die, and solutions including embedded memory, cSSD, and eSSD for a wide range of applications including mobile devices, PCs, and data centers. In October 2017, YMTC successfully designed and manufactured China's first 3D NAND flash memory by combining independent R&D and international cooperation. In September 2019, 64-layer TLC 3D NAND flash memory with innovative Xtacking® architecture was officially put into mass-production. April 2020, YMTC has announced its 128-layer 1.33Tb QLC 3D NAND flash memory chip, X2-6070, has passed sample verification on the SSD platform, achieved the highest bit density, highest I/O speed and highest capacity so far among all released flash memory parts in the industry. YMTC has R&D centers in Wuhan, Shanghai, Beijing and other places. There are more than 6,000 employees worldwide, including about 2,200 R&D engineers. YMTC is committed to becoming a global leading NAND flash memory solution provider through persistent efforts and technical innovations.
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MediaTek wins Meta's 2nm ASIC order, Asus partners with Microsoft for Xbox handhelds, YMTC plans China-made NAND line, and other key developments in the tech industry.
Chinese memory makers CXMT and YMTC are ramping up production using domestic EDA tools, with Empyrean Technology gaining prominence in the sector.
Chinese companies join the advanced hybrid bonding race as global chipmakers accelerate development. This technology is seen as crucial for future performance gains in the semiconductor industry.
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