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Solidigm is a leading global provider of innovative NAND flash memory solutions. Solidigm technology unlocks data’s unlimited potential for customers, enabling them to fuel human advancement. Our origins reflect Intel’s longstanding innovation in memory products and SK hynix’s international leadership and scale in the semiconductor industry, Solidigm became a standalone U.S. subsidiary under SK hynix in December 2021. Headquartered in San Jose, CA, Solidigm is powered by the inventiveness of close to 2,000 employees in 20 locations around the world. For more information about Solidigm, please visit https://www.solidigmtechnology.com
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21 signals in the last 90 days.
The order this company entered each market — oldest to newest
Solidigm Partners with Taiwan Manufacturers
SOC Development Engineer
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How Solidigm's international expansion compares to its competitors
SolidigmYouBars show relative size across the companies compared.
5 metrics| Company | Markets | New markets | Momentum | Activity | Expansion score |
|---|---|---|---|---|---|
 SolidigmYou | 5 | 0 | +63% | 21 | 47 |
Scaling fast — 39 roles opened in the last 90 days, up 155% vs the prior period. Engineering-led and concentrated in United States.
Rancho Cordova, CA · 5d ago
Senior DevOps Technical Manager
Rancho Cordova, CA · 5d ago
Firmware Product Lead
Vancouver, British Columbia, Canada · 5d ago
Media Firmware Development Engineer
29 technologies detected across the stack.
25 active campaigns across 27 markets.
Active
Ended
Ended61 mentions in the last 90 days.
SK Hynix progresses with share buyback while subsidiary Solidigm expands Taiwan manufacturing for AI server SSDs. Analysts show mixed views ahead of Q3 results, citing HBM pricing and Samsung competition.
SK Hynix's Solidigm partners with Taiwan's Powertech and Pegatron to expand AI data center SSD production, with orders potentially reaching hundreds of billions TWD annually, starting shipments in December 2024.
SK Hynix's NAND flash subsidiary Solidigm has selected Goldman Sachs and Morgan Stanley as lead underwriters for a US IPO next year, with potential offering size of $10 billion and valuation up to $100 billion.
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